SKU: 40319765277

KADEM Phone Case For Xiaomi Redmi Note 13 Pro 5G / Poco X6 5G / X6 Neo 5G Electroplating Silk Texture PU + TPU Back Cover

Sale price$65.07 Regular price$72.30
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Ships within 48 hours · Estimated delivery Jul 13 - Jul 18

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Description

KADEM Phone Case For Xiaomi Redmi Note 13 Pro 5G / Poco X6 5G / X6 Neo 5G Electroplating Silk Texture PU + TPU Back CoverPremium ElectroplatingFeatures a high quality electroplated finish for a sleek and stylish look that enhances the phone's elegance. Silk Texture DesignThe PU leather surface with a silk like texture provides a smooth, comfortable grip while adding a touch of sophistication. Shockproof & Scratch ResistantConstructed with a durable TPU inner layer to absorb shocks and prevent scratches from daily wear and tear. Precise CutoutsDesigned with accurately

  • 【Premium Electroplating】Features a high-quality electroplated finish for a sleek and stylish look that enhances the phone's elegance.
  • 【Silk Texture Design】The PU leather surface with a silk-like texture provides a smooth, comfortable grip while adding a touch of sophistication.
  • 【Shockproof & Scratch-Resistant】Constructed with a durable TPU inner layer to absorb shocks and prevent scratches from daily wear and tear.
  • 【Precise Cutouts】Designed with accurately aligned openings for the camera, buttons, and ports, ensuring seamless access to all functions without removing the case.
  • 【Easy to Install & Pocket-Friendly】Flexible material allows for effortless installation and removal, while the slim design slides easily into your pocket without adding bulk.

Compatible with

  • Xiaomi Redmi Note 13 Pro 5G
  • Xiaomi Poco X6 5G
  • Xiaomi Poco X6 Neo 5G
  • Xiaomi

Package included

  • 1 x Phone Case
  • Other things not included

Specifications

Brand KADEM
Case Feature N/A
Color Black
Material PU Leather,TPU
Packaging Type Simple PP Bag
Surface Workmanship Electroplating
Texture Silk
Gross Weight 0.045kg
Volume Weight 0.047kg
Package Length 17.500cm
Package Width 8.000cm
Package Height 1.500cm
Shipping Notes
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Exchange/Return Notes
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  • Final sale items are not eligible for returns or exchanges.
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SKU: 40319765277

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4.2 ★★★★★
Based on 326 reviews
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D
Donald A. Tevault
Dallas, US
★★★★★ 5
Lots of good info, easy to read
Format: Paperback
Okay, I do need to disclose that I was one of the technical reviewers for this book, and that I'm also a fellow Packt Publishing author. Reviewing the book was a fun project, which I really enjoyed. There's a lot of good information here, and lots of hands-on projects for both x86_64 and Raspberry Pi. The author writes in a clear, concise, and conversational style that makes the material really easy to digest. If you have a good foundation of C programming knowledge and want to get into Linux kernel programming, you'll definitely want to check this book out.
WAS THIS REVIEW HELPFUL?YesReportShare
Reviewed in the United States on March 31, 2021
S
Verified Purchase
Sammy
New York, US
★★★★★ 5
ASM and CPP best of both worlds in Windows env
Format: Paperback
A must read if you are interested in writing assmbly code that communicates with C++ code in a windows envionment.
WAS THIS REVIEW HELPFUL?YesReportShare
Reviewed in the United States on March 12, 2023
A
Verified Purchase
Anonymous
Natrona Heights, US
★★★★★ 5
A good book but...(update, formatting fixed)
Format: Kindle
A good book but the code in the Kindle edition is very badly formatted. The downloaded source code seems correct. Update formatting issue seems to have been fixed.
WAS THIS REVIEW HELPFUL?YesReportShare
Reviewed in the United States on February 7, 2022
T
Verified Purchase
Tomasz
Whiting, US
★★★★★ 5
Great book
Format: Paperback
Great book
WAS THIS REVIEW HELPFUL?YesReportShare
Reviewed in the United States on July 6, 2023
H
Verified Purchase
Harry G.
Phoenix, US
★★★★★ 4
Good for basic x86 64 but avx coverage is horrible.
Format: Paperback
After having read Irvine 7th I had a good knowledge of x32 but soon enough I realized it’s all obsolete so now it’s on to Hyde 64. The hello world program involves interfacing to c++ and assembly/linking with batch commands. Really? I’m using visual studio ide have you heard of build and run? Hyde doesn’t even mention the debugger and without this tool assembly language is impossible. But I was already familiar with this after reading Irvine so I was ok. The following chapters 2 to 9 about 600 pages worth are great so for what I paid the book is 4 stars. Great explanation, lots of complete programs. Now it’s time for parallel processing via Simd and avx and this is chapter 11, over 100 pages of instructions with no examples. It could be useful for reference but actually, no. Amidst all the formats, memory operand and register sizes the actual explanations of the instructions are vague. Well that defeats the purpose of thumbing this chapter as a reference doesn’t it? But where Hyde fails Kusswurm modern x86 begins. If you’ve made it this far sell Hyde, Irvine, and buy Kusswurm. Then you’ll have Jedi powers like me.
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Reviewed in the United States on December 5, 2023

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